ACES-金属冲压件

Bracket

Customized Brackets
Chassis Enclosure Solutions
Cooling Tanks Immersion Battery Enclosures

Cooling Tanks Immersion Battery Enclosures
CPU fan bracket

Processes: Electroplating, soldering, screw insertion, thin film bonding.
EMI Shielding

Material: SPTE, SGCC
Thickness: 0.15~0.3mm Bonding
material: Insulating PET film
IO Shielding

Used for the Input & Output positions on the motherboard.
Processes: Insertion, printing, thin film bonding.
Kiosk Energy Storage Cabinets

Kiosk Energy Storage Cabinets
Medium to large-sized chassis assembly components

Medium to large-sized chassis assembly components
Medium-sized structural components

Processes: Electroplating, soldering, baking paint, insertion, printing, thin film bonding
Mid-size computer case

Processes: Electroplating, baking paint, printing, insertion, assembly
Thin stainless steel structural parts

Thin stainless steel structural parts
Types and sizes of aluminum structural exterior parts

Types and sizes of aluminum structural exterior parts
Types of medium-sized sturdy framework brackets

Material: SPCC, SGCC
Bonding material: Thermal conductive adhesive
Processes: Electroplating, baking paint, insertion, printing, thin film bonding
VGA, Motherboard Brackets & Thin structure Components

VGA, Motherboard Brackets & Thin structure Components